11

NOTE ON CORRECT USE

(1) Observe precautions for handling because of electro-static sensitive devices.

(2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired oscillation).

All the ground pins must be connected together with wide ground pattern to decrease impedance difference.

(5) The DC cut capacitor must be each attached to the input and output pins.

RECOMMENDED SOLDERING CONDITIONS

This product should be soldered in the following recommended conditions. Other soldering methods and condi-

tions than the recommended conditions are to be consulted with our sales representatives.

µµµµPC2776TB

Soldering method

Soldering conditions

Recommended condition symbol

Infrared ray reflow

Package peak temperature: 235

°C, Hour: within 30 s.

(more than 210

IR35-00-3

VPS

Package peak temperature: 215

°C, Hour: within 40 s.

(more than 200

VP15-00-3

Wave soldering

Soldering tub temperature: less than 260

°C, Hour: within 10 s.

Time: 1 time, Limited days: no.

Note

WS60-00-1

Pin part heating

Pin area temperature: less than 300

°C, Hour: within 3 s/pin.

Limited days: no.

Note

Note It is the storage days after opening a dry pack, the storage conditions are 25

°C, less than 65 % RH.

Caution The combined use of soldering method is to be avoided (However, except the pin area heating

method).

For details of recommended soldering conditions for surface mounting, refer to information document SEMICON-

DUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).