IRF730 datasheet(2/7 Pages) INTERSIL

2 / 7 page

4-233

Absolute Maximum Ratings

TC = 25

oC, Unless Otherwise Speciﬁed

IRF730

UNITS

Drain to Source Voltage (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDS

400

Drain to Gate Voltage (RGS = 20kΩ) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . VDGR

400

Continuous Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ID

TC = 100

oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I

5.5

3.5

Pulsed Drain Current (Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .IDM

Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VGS

±20

Maximum Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PD

Linear Derating Factor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

0.6

W/oC

Single Pulse Avalanche Energy Rating (Note 4) . . . . . . . . . . . . . . . . . . . . . . . EAS

300

Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . TJ, TSTG

-55 to 150

Maximum Temperature for Soldering

Leads at 0.063in (1.6mm) from Case for 10s . . . . . . . . . . . . . . . . . . . . . . . . . .TL

Package Body for 10s, See Techbrief 334 . . . . . . . . . . . . . . . . . . . . . . . . . . Tpkg

300

260

CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operationofthe

device at these or any other conditions above those indicated in the operational sections of this speciﬁcation is not implied.

NOTE:

1. TJ = 25

oC to 125oC.

Electrical Speciﬁcations

TC = 25

oC, Unless Otherwise Speciﬁed

PARAMETER

SYMBOL

TEST CONDITIONS

MIN

TYP

MAX

UNITS

Drain to Source Breakdown Voltage

BVDSS

ID = 250µA, VGS = 0V (Figure 10)

400

Gate Threshold Voltage

VGS(TH)

VDS = VGS, ID = 250µA

2.0

4.0

Zero Gate Voltage Drain Current

IDSS

VDS = Rated BVDSS, VGS = 0V

µA

VDS = 0.8 x Rated BVDSS, VGS = 0V, TJ = 125

250

µA

On-State Drain Current (Note 2)

ID(ON)

VDS >ID(ON) xrDS(ON)MAX,VGS = 10V (Figure 7)

5.5

Gate to Source Leakage Current

IGSS

VGS = ±20V

±100

Drain to Source On Resistance (Note 2)

rDS(ON)

ID = 3.0A, VGS = 10V (Figure 8, 9)

0.800

1.000

Ω

Forward Transconductance (Note 2)

gfs

VDS ≥ 10V, ID = 3.3A (Figure 12)

2.9

4.4

Turn-On Delay Time

td(ON)

VDD = 200V, ID ≈ 5.5A, RGS = 12Ω, RL = 35Ω

MOSFET Switching Times are Essentially

Independent of Operating Temperature

-10

Rise Time

-20

Turn-Off Delay Time

td(OFF)

-35

Fall Time

-15

Total Gate Charge

(Gate to Source + Gate to Drain)

Qg(TOT)

VGS = 10V, ID = 5.5A, VDS = 0.8 x Rated BVDSS,

Ig(REF) = 1.5mA, (Figure 14)

Gate Charge is Essentially Independent of

Operating Temperature

-20

Gate to Source Charge

Qgs

3.0

Gate to Drain “Miller” Charge

Qgd

-10-

Input Capacitance

CISS

VDS = 25V, VGS = 0V, f = 1MHz (Figure 11)

600

Output Capacitance

COSS

150

Reverse Transfer Capacitance

CRSS

-40-

Internal Drain Inductance

Measured From the

Contact Screw on Tab to

Center of Die

Modified MOSFET

Symbol Showing the

Internal Device

Inductances

3.5

Measured From the Drain

Lead, 6mm (0.25in) From

Package to Center of Die

4.5

Internal Source Inductance

Measured From the

Source Lead, 6mm

(0.25in) From Header to

Source Bonding Pad

7.5

Thermal Resistance Junction to Case

RθJC

1.67

oC/W

Thermal Resistance Junction to Ambient

RθJA

Free Air Operation

oC/W

IRF730

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