3-13

All Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems.

Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality

Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice.

Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable.

However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its

use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.

For information regarding Intersil Corporation and its products, see www.intersil.com

Sales Office Headquarters

NORTH AMERICA

Intersil Corporation

7585 Irvine Center Drive

Suite 100

Irvine, CA 92618

TEL: (949) 341-7000

FAX: (949) 341-7123

Intersil Corporation

2401 Palm Bay Rd.

Palm Bay, FL 32905

TEL: (321) 724-7000

FAX: (321) 724-7946

EUROPE

Intersil Europe Sarl

Ave. C - F Ramuz 43

CH-1009 Pully

Switzerland

TEL: +41 21 7293637

FAX: +41 21 7293684

ASIA

Intersil Corporation

Unit 1804 18/F Guangdong Water Building

83 Austin Road

TST, Kowloon Hong Kong

TEL: +852 2723 6339

FAX: +852 2730 1433

ISL5761

Thin Shrink Small Outline Plastic Packages (TSSOP)

α

INDEX

AREA

E1

D

N

12

3

-B-

0.10(0.004)

C A

M

BS

e

-A-

b

M

-C-

A1

A

SEATING PLANE

0.10(0.004)

c

E

0.25(0.010)

B

M

M

L

0.25

0.010

GAUGE

PLANE

A2

NOTES:

1. These package dimensions are within allowable dimensions of

JEDEC MO-153-AE, Issue E.

2. Dimensioning and tolerancing per ANSI Y14.5M-1982.

3. Dimension “D” does not include mold flash, protrusions or gate burrs.

Mold flash, protrusion and gate burrs shall not exceed 0.15mm

(0.006 inch) per side.

4. Dimension “E1” does not include interlead flash or protrusions. Inter-

lead flash and protrusions shall not exceed 0.15mm (0.006 inch) per

side.

5. The chamfer on the body is optional. If it is not present, a visual index

feature must be located within the crosshatched area.

6. “L” is the length of terminal for soldering to a substrate.

7. “N” is the number of terminal positions.

8. Terminal numbers are shown for reference only.

9. Dimension “b” does not include dambar protrusion. Allowable dambar

protrusion shall be 0.08mm (0.003 inch) total in excess of “b” dimen-

sion at maximum material condition. Minimum space between protru-

sion and adjacent lead is 0.07mm (0.0027 inch).

10. Controlling dimension: MILLIMETER. Converted inch dimensions

are not necessarily exact. (Angles in degrees)

0.05(0.002)

M28.173

28 LEAD THIN SHRINK SMALL OUTLINE PLASTIC

PACKAGE

SYMBOL

INCHES

MILLIMETERS

NOTES

MIN

MAX

MIN

MAX

A-

0.047

-

1.20

-

A1

0.002

0.006

0.05

0.15

-

A2

0.031

0.051

0.80

1.05

-

b

0.0075

0.0118

0.19

0.30

9

c

0.0035

0.0079

0.09

0.20

-

D

0.378

0.386

9.60

9.80

3

E1

0.169

0.177

4.30

4.50

4

e

0.026 BSC

0.65 BSC

-

E

0.246

0.256

6.25

6.50

-

L

0.0177

0.0295

0.45

0.75

6

N28

28

7

α

-

Rev. 0 6/98