µPD16857

13

Data Sheet S13908EJ1V0DS00

RECOMMENDED SOLDERING CONDITIONS

Solder this product under the following recommended conditions.

For details of the recommended soldering conditions, refer to information document Semiconductor Device

Mounting Technology Manual (C10535E).

For soldering methods and conditions other than those recommended, consult NEC.

Soldering Method

Soldering Conditions

Recommended

Condition symbol

Package peak temperature: 235

°C; Time: 30 secs. max. (210 °C min.);

Infrared reflow

Number of times: 3 times max.; Number of day: none;

IR35-00-3

Flux: Rosin-based flux with little chlorine content (chlorine: 0.2 Wt% max.)

is recommended

Package peak temperature: 215

°C; Time: 40 secs. max. (200 °C min.);

VPS

Number of times: 3 times max.; Number of day: none;

VP15-00-3

Flux: Rosin-based flux with little chlorine content (chlorine: 0.2 Wt% max.)

is recommended.

Package peak temperature: 260

°C; Time: 10 secs. max.;

Wave soldering

Number of times: once; Flux: Rosin-based flux with little chlorine content

WS60-00-1

(chlorine: 0.2 Wt% max.) is recommended.

Caution Do not use two or more soldering methods in combination.