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AN4569 Datasheet(PDF) 26 Page - STMicroelectronics |
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AN4569 Datasheet(HTML) 26 Page - STMicroelectronics |
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26 / 29 page ![]() Layout AN4569 26/29 DocID026803 Rev 1 4.5 Thermal dissipation To dissipate heat, it is mandatory to have a big ground plane on both (top and bottom) layers and solder the slug on the PCB; Figure 33. Thermal dissipation Thermal layout with big ground (1/3 for top and bottom layers) Figure 34. Thermal layout for top and bottom layer Thermal layout with large ground (2/3 for thermal and soldering holes) Figure 35. Thermal dissipation - holes under IC The thermal resistance junction in the bottom of the STA3xyBWz in order to maintain ambient temperature is obtainable with a ground copper area of 4x4 cm and with 24 via holes (refer to the example shown in the figure above). |
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