µPD3729

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RECOMMENDED SOLDERING CONDITIONS

When soldering this product, it is highly recommended to observe the conditions as shown below.

If other soldering processes are used, or if the soldering is performed under different conditions, please make sure

to consult with our sales offices.

For more details, refer to our document "Semiconductor Device Mounting Technology Manual"(C10535E).

Type of Through-hole Device

µPD3729D: CCD linear image sensor 24-pin ceramic DIP (400 mil)

Process

Conditions

Partial heating method

Pin temperature: 300

°C or below,

Heat time: 3 seconds or less (per pin)