7

LT1935

1935f

PACKAGE DESCRIPTIO

S5 Package

5-Lead Plastic TSOT-23

(Reference LTC DWG # 05-08-1635)

1.50 – 1.75

(NOTE 4)

2.80 BSC

0.30 – 0.45 TYP

5 PLCS (NOTE 3)

DATUM ‘A’

0.09 – 0.20

(NOTE 3)

S5 TSOT-23 0302

PIN ONE

2.90 BSC

(NOTE 4)

0.95 BSC

1.90 BSC

0.80 – 0.90

1.00 MAX

0.01 – 0.10

0.20 BSC

0.30 – 0.50 REF

NOTE:

1. DIMENSIONS ARE IN MILLIMETERS

2. DRAWING NOT TO SCALE

3. DIMENSIONS ARE INCLUSIVE OF PLATING

3.85 MAX

0.62

MAX

0.95

REF

RECOMMENDED SOLDER PAD LAYOUT

PER IPC CALCULATOR

1.4 MIN

2.62 REF

1.22 REF

4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR

5. MOLD FLASH SHALL NOT EXCEED 0.254mm

6. JEDEC PACKAGE REFERENCE IS MO-193

GND

SW

SHDN

FB

2.3V TO 4.8V

D1

L1

1.8µH

R1

29.4k

LT1935

C3

150pF

1935 TA01

C2

20µF

C1

4.7µF

R2

10k

5V

C1, C2: X5R OR X7R 6.3V

D1: ON SEMI MBRM120

L1: SUMIDA CR43-1R8

ON OFF

LOAD CURRENT (mA)

0

1200

400

200

600

1000

800

90

85

80

75

70

65

60

55

50

5V Boost Converter

TYPICAL APPLICATIO S

GND

SW

SHDN

FB

3.3V

D1

L1

4.2µH

R1

84.5k

LT1935

1935 TA02

C2

22µF

C1

4.7µF

R2

10k

12V

320mA

D1: ON SEMI MBRM120

L1: SUMIDA CDRH5D28-4R2

ON OFF

47pF

3.3V to 12V Boost Converter

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-

tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.