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AN1256 Datasheet(PDF) 2 Page - STMicroelectronics

Part # AN1256
Description  High-power RF MOSFET targets VHF applications
PDF  7 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

AN1256 Datasheet(HTML) 2 Page - STMicroelectronics

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Device assembly
AN1256
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1
Device assembly
The SD2933 discrete component design consists of two 40 cell, N-channel, enhancement
mode DMOS transistor dice eutectically mounted in a parallel configuration (see Figure 2).
Each cell consists of 60, 127 µm gate fingers, yielding a source periphery of 1220 mm
allowing a maximum drain current of 40 A. The transistor dice are separated by a metallized
gate rail on which two, thin film, Au metallized resistors are eutectically mounted. For
improved current capability and lower inductance, the components are connected to each
other and to the package by Au wire with a diameter of 2 mils (50 µm). Since the dice and
package utilize gold metallization and the bonding wires are also gold, reliability issues
pertaining to the contact of dissimilar metals between wire, package, and die are eliminated.
The package is sealed with a ceramic lid ensuring the complete integrity of the wires and
silicon die and also preventing any foreign objects from entering the package which could
ultimately cause device reliability problems.
2
Device characteristics
The SD2933 has a very high transconductance. The transconductance (gfs) denotes the
DC gain of a Power MOSFET. It is defined as the ratio of the infinitesimal change in drain
current corresponding to the infinitesimal change in gate voltage at a specified current level
and drain bias. It is important to measure the gfs in the device’s region of operation where
the gfs is independent of the drain bias (VDS). The gfs of the SD2933 measured at a drain-
source voltage of 10 V and a corresponding drain current of 10 A, is typically 13 siemens.
Impedance data across a range of frequencies may be the most important information an
amplifier designer needs. Without it, the RF performance may not come close to the
published values found in the datasheet. With properly measured data, and sound
impedance matching techniques, many frustrating hours of circuit design iterations can be
saved.
For this reason, the following impedances were measured to help in the design of amplifiers
for the HF, FM broadcast, and plasma generation markets as shown in Figure 1.
One important item to note is the relatively small change in input impedance from 30 MHz to
150 MHz. This can be attributed to the series gate resistors which present a real impedance
at the input across the full band of frequencies. Matching is easily accomplished by using
transmission line transformers and lumped elements commonly found in many amplifiers.
The SD2933 was characterized in a common source mode at 30 MHz with a circuit
optimized for best return loss and maximum power delivered to the load with a typical gain
and efficiency of 23.5 dB and 65% respectively, as shown in Figure 3. The junction to case
thermal resistance (RTH-JC) was measured under RF operating conditions using infrared
Table 1.
Impedance data for the design of amplifiers
Frequency (MHz)
ZIN(
Ω)
ZDL(
Ω)
30
1.8 - j0.2
2.8 + j2.3
108
1.9 + j0.2
1.6 + j1.4
175
1.9 + j0.3
1.5 + j1.6



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