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AN3431 Datasheet(PDF) 11 Page - STMicroelectronics |
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AN3431 Datasheet(HTML) 11 Page - STMicroelectronics |
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11 / 18 page ![]() AN3431 Mechanical construction considerations Doc ID 019017 Rev 1 11/18 2.2 Application rigidity and adhesion of layers The PresSense should be in a neutral position where no points on the back of the PCB should be stressed. The PCB should have uniform pressure across the system and should not be allowed to deform/move if a force is exerted onto the conductive top cover. It is strongly recommended to have a backing support of rigid insulating material pressing the PCB uniformly against the spacer layer. Figure 5 (part 2) shows ‘mechanical problem 1’ where the system deforms when a force is applied. Figure 5. Mechanical problem 1 1. No force applied 2. Force applied (incorrect movement) 3. Force applied (correct movement) Table 2. Mechanical problem 1 analysis Possible mechanical problems in Figure 5 Electrical consequences Spacer layer not made from nondeformable material - entire system deforms downwards. Increased capacitance on buttons 1 and 2 with possible false detection on both Mechanical support behind PCB is not in a neutral position - whole structure (conductive top cover, spacer layer, and PCB layer) deforms downwards. |
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