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RM0319 Datasheet(PDF) 32 Page - STMicroelectronics |
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RM0319 Datasheet(HTML) 32 Page - STMicroelectronics |
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32 / 368 page  Multilayer interconnect matrix (BUSMATRIX) RM0319 32/368 Doc ID 022640 Rev 3 Table 4. Connectivity matrix table definition Note: EMI or FSMC memory are interconnected with DMA port #1. SSP1, SSP2, UART1, UART2, I2C1, I2C2, I2S, RS485 peripherals interconnected with DMA port #2 4.2 Interconnection matrices (ICMs) The AMBA system has eight programmable multilayer interconnection matrices (ICMs). The ICM allows multiple master layers to access a slave (see Figure 4). Table 3. Connectivity matrix Targets MemCtr#0 REQ MemCtr#1 REQ MemCtr#2 ICM5 REQ1 REQ2 MemCtr#3 ICM7 REQ1 REQ2 REQ3 REQ4 MemCtr#4 ICM8 REQ1 REQ2 RAS_I REQ RAS_M REQ RAS_G1 REQ RAS_G2 REQ RAS_F ICM6 REQ1 REQ2 Sbs_LowSpeed ICM1 REQ1 REQ2 REQ3 Sbs_High Speed ICM4 REQ1 REQ2 Sbs_Basic ICM3 REQ1 REQ2 Sbs_Application LCM2 REQ1 REQ3 REQ2 Format Definition Grey box No connection exists between target and initiator White box A connection exists between target and initiator ‘Req’ A connection that is required between target and initiator |
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