8

LT1308A/LT1308B

Figure 6. Recommended Component Placement for SEPIC

Figure 5. SEPIC (Single-Ended Primary

Inductance Converter) Converts 3V to 10V

Input to a 5V/500mA Regulated Output

Figure 4. Recommended Component Placement for Boost

Converter. Note Direct High Current Paths Using Wide PC

Use Multiple Vias to Tie Pin 4 Copper to Ground Plane. Use

Vias at One Location Only to Avoid Introducing Switching

Currents into the Ground Plane

1

2

8

7

3

4

6

5

L1

C2

D1

LBO

LBI

LT1308A

LT1308B

GND

SHUTDOWN

R1

R2

MULTIPLE

VIAs

GROUND PLANE

1308 F04

+

C1

+

SW

FB

LT1308B

L1A

CTX10-2

L1B

D1

47k

R2

100k

R1

309k

680pF

1308A/B F05

C1

47

µF

C3

220

µF

6.3V

C2

4.7

µF

CERAMIC

5V

500mA

3V TO

10V

GND

SHDN

SHUTDOWN

C1: AVX TAJC476M016

C2: TAIYO YUDEN EMK325BJ475(X5R)

C3: AVX TPSD227M006

+

+

D1: IR 10BQ015

L1: COILTRONICS CTX10-2

1

2

8

7

3

4

6

5

C3

L1A

L1B

D1

LBO

LBI

LT1308A

LT1308B

GND

SHUTDOWN

R1

R2

GROUND PLANE

1308 F06

MULTIPLE

VIAs

+

C2

C1

+