TS2596

3A / 150KHz Buck Dc-Dc Converter

5/9

Version: E13

Pin Function Description (Continue)

Thermal Considerations

but with copper areas greater than approximately 6 in

2

, only small improvements in heat dissipation are realized. If

further thermal improvements are needed, double sided, multilayer PC board with large copper areas and/or airflow

are recommended.

The TS2596 (TO-263-5L package) junction temperature rise above ambient temperature with a 3A load for various

input and output voltages. This data was taken with the circuit operating as a buck switching regulator with all

components mounted on a PC board to simulate the junction temperature under actual operating conditions. This

curve can be used for a quick check for the approximate junction temperature for various conditions, but be aware

that there are many factors that can affect the junction temperature. When load currents higher than 3A are used,

double sided or multilayer PC boards with large copper areas and/or airflow might be needed, especially for high

ambient temperatures and high output voltages.

For the best thermal performance, wide copper traces and generous amounts of printed circuit board copper

should be used in the board layout. (Once exception to this is the output (switch) pin, which should not have large

areas of copper.) Large areas of copper provide the best transfer of heat (lower thermal resistance) to the

surrounding air, and moving air lowers the thermal resistance even further.