TS19720

Taiwan Semiconductor

Document Number: DS_P0000210

2

Version: B15

PARAMETER

SYMBOL

LIMIT

UNIT

Power Supply Pin

40

V

RT Voltage to GND

-0.3 to 5.5

V

OUT Voltage to GND

-0.3 to 40

V

CS Voltage to GND

-0.3 to 5.5

V

COM Voltage to GND

-0.3 to 5.5

V

0.3

W

ESD Rating (Human Body Mode)

(Note 2)

HBM

2

kV

ESD Rating (Machine Mode)

MM

200

V

Lead Temperature (Soldering 10 sec)

260

°C

Junction Temperature Range

-40 to +150

°C

Storage Temperature Range

-65 to +150

°C

THERMAL PERFORMANCE

PARAMETER

SYMBOL

LIMIT

UNIT

Junction to Case Thermal Resistance

106.6

°C/W

Junction to Ambient Thermal Resistance

220

°C/W

with the component mounted on a low effective thermal conductivity test board in free

PARAMETER

SYMBOL

CONDITIONS

UNIT

Power Supply Pin

33

V

RT Voltage to GND

-0.3 to 5

V

OUT Voltage to GND

-0.3 to 19

V

CS Voltage to GND

-0.3 to 5

V

COM Voltage to GND

-0.3 to 5

V

Operating Junction Temperature Range

-40 to +125

°C

Operating Ambient Temperature Range

-40 to +85

°C