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RF5506 Datasheet(PDF) 5 Page - RF Micro Devices |
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RF5506 Datasheet(HTML) 5 Page - RF Micro Devices |
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5 / 9 page ![]() 5 of 9 RF5506 DS120326 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. Package Drawing PCB Pattern Thermal vias for center slug "B" should be incorporated into the PCB design. The number and size of thermal vias will depend on the application, the power dissipation, and the electrical requirements. Example of the number and size of vias can be found on the RFMD evaluation board layout. A = 0.250 x 0.250 (mm) B = 1.900 x 1.900 (mm) PCB METAL LAND PATTERN PCB SOLDER MASK PATTERN PCB STENCIL PATTERN B A = 0.380 x 0.380 (mm) B = 2.030 x 2.030 (mm) A = 0.225 x 0.225 (mm) B = 1.710 x 1.710 (mm) A A A A A A A A A A A A A A A A A AA A A AA A A A A A A A A A B A AA A A AA A A A A A A A A A B 4x 1.317 4x 1.317 2x 0.750 2x 0.750 2x 0.250 2x 0.250 0.000 16x 0.242 12x 0.250 4x 1.317 4x 1.317 2x 0.750 2x 0.750 2x 0.250 2x 0.250 0.000 16x 0.112 12x 0.120 4x 1.317 4x 1.317 2x 0.750 2x 0.750 2x 0.250 2x 0.250 0.000 16x 0.350 12x 0.275 Shaded area represents Pin 1 location. |
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