RF Micro Devices Inc.

7628 Thorndike Road, Greensboro, NC 27409-9421

DS140204

For sales or technical support, contact RFMD at +1.336.678.5570 or customerservice@rfmd.com.

The information in this publication is believed to be accurate. However, no responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use, nor for any infringement of patents or other rights of

third parties resulting from its use. No license is granted by implication or otherwise under any patent or patent rights of RFMD. RFMD reserves the right to change component circuitry, recommended

application circuitry and specifications at any time without prior notice.

6 of 8

SDA-2000

Pin Names and Descriptions

Pin

Name

Description

Interface Schematic

1

RFIN

RF Input. This pad is DC coupled and matched to 50

Ω from DC to

22GHz. 50

Ω microstrip transmission line on 0.127mm (5mil) thick

alumina thin film substrate is recommended for RF input and

output. A DC blocking capacitor is required for this connection. The

calue of this capacitor will be based on the desired frequency range

of application.

2

VG2

Each amplifier stage in the SDA-2000 is a cascade configuration.

The gate of each upper FET in the cascade amplifiers is biased

device gates runs across the length of the die. Pads 2 and 5 are

both on this DC connection but are on opposite ends of the die.

bypass capacitor is recommended on both ends, pads 2 and 5.

3

VTO

The output drain termination pad. This pad requires a 1000pF

bypass capacitor with the shortest wirebond length to prevent low

frequency gain ripple.

4

RFOUT and

VDD

RF Output. 50

Ω microstrip transmission line on 0.127mm (5mil)

thick alumina thin film substrate is recommended for RF input and

bias tee or external bias network.

5

VCAS

Each amplifier stage in the SDA-2000 is a cascade configuration.

The gate of each upper FET in the cascade amplifiers is biased

device gates runs across the length of the die. Pads 2 and 5 are

both on this DC connection but are on opposite ends of the die.

bypass capacitor is recommended on both ends, pads 2 and 5.

6

VG21

Not connected.

7

VTI

Input gate voltage for the lower devices in the cascade amplifier.

This pad also serves as the RF ground for the input termination

capacitor will effect the low frequency response of the amplifier.

Die

GND

Ground connection. Connect die bottom directly to ground plane for

best performance. NOTE: The die should be connected directly to

the ground plane with conductive epoxy.