RF Micro Devices Inc.

7628 Thorndike Road, Greensboro, NC 27409-9421

DS140204

For sales or technical support, contact RFMD at +1.336.678.5570 or customerservice@rfmd.com.

The information in this publication is believed to be accurate. However, no responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use, nor for any infringement of patents or other rights of

third parties resulting from its use. No license is granted by implication or otherwise under any patent or patent rights of RFMD. RFMD reserves the right to change component circuitry, recommended

application circuitry and specifications at any time without prior notice.

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SDA-2000

Measurement Technique

All data presented in this document represents the integrated circuit and accompanying bond wires.

All performance data reported in this document were measured in the following manner. Data was taken using a temperature

controlled probe station utilizing 150μm pitch GSG probes. The interface between the probes and integrated circuit was made

with a coplanar to microstrip ceramic test interface. The test interface was wire bonded to the die using 1mil diameter bondwires.

The spacing between the test interface and the die was 200μm, and the bond wire loop height was 100μm. The calibration

of the test fixture included the probes and test interfaces, so that the measurement reference plane was at the point of

bond wire attachment to the ceramic interface.

SDA-2000 Product Image