NICHIA STS-DA1-3425 <Cat.No.141225>

5

SOLDERING

• Recommended Hand Soldering Condition

Temperature

350°C Max

Soldering Time

3sec Max

Position

No closer than 2mm from

the base of the lens.

• Recommended Dip Soldering Condition

Pre-Heat

120°C Max

Pre-Heat Time

60sec Max

Solder Bath

Temperature

260°C Max

Dipping Time

10sec Max

Dipping Position

No closer than 2mm from

the base of the lens.

* Solder the LED no closer than 2mm from the base of the lens.

Soldering beyond the base of the tie bar is recommended.

* Dip soldering/hand soldering must not be performed more than once.

* Care should be taken to avoid cooling at a rapid rate and ensure the peak temperature ramps down slowly.

* When soldering, do not apply stress to the lead frame while the LED is hot.

* When using a pick and place machine, choose an appropriate nozzle for this product.

* After soldering, the LED position must not be corrected.

* After soldering, NO mechanical shock or vibration should be applied to LED lens

until the LEDs cool down to room temperature.

* In order to avoid damage on the lens during cutting and clinching the leads,

it is not recommended to solder the LEDs directly on customer PCB without any gap between the lens and the board.

If it is unavoidable, customer is advised to check whether such soldering will not cause wire breakage or lens damage.

Direct soldering to double-sided PCBs must be avoided due to an increased effect of heat on the lens.

* When it is necessary to clamp the LEDs to prevent soldering failure,

it is important to minimize the mechanical stress on the LEDs.

* Cut the LED lead frames at room temperature. Cutting the lead frames at high temperature may cause failure of the LEDs.

* Consider factors such as the dip soldering temperature, hand soldering temperature, etc. when choosing the solder.

* When flux is used, it should be a halogen free flux. Ensure that the manufacturing process is not designed in a manner

where the flux will come in contact with the LEDs.