10.7Gbps EAM Driver

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11

17

18

19

20

21

22

23

GND

MODN2

MOD

MODN1

GND

8

7

6

5

4

3

2

CLK-

CLK+

DATA-

DATA+

MAX3935

1

24

N.C.

TOP VIEW

THE EXPOSED PAD MUST BE SOLDERED TO

SUPPLY GROUND ON THE CIRCUIT BOARD.

Pin Configuration

Chip Topography

The origin for pad coordinates is the center of the die.

All pad locations are referenced from the origin and

indicate the center of the pad where the bond wire

should be connected. For more information on bonding

coordinates refer to Maxim Application Note HFAN-

08.0.1: Understanding Bonding Coordinates and

Physical Die Size on Maxim’s website.

Chip Information

TRANSISTOR COUNT: 1535

SUBSTRATE: INSULATOR, CONNECT TO GND

PROCESS: SiGe BIPOLAR

DIE THICKNESS: 8 mils

Chip Topography

CLK-

CLK+

DATA-

DATA+

GND

MODN1

MOD1

MOD2

MODN2

GND

GND

N.C.

MODSET

MODMON

GND

GND

GND

N.C.

N.C.

PWC-

PWC+

N.C.

N.C.

GND

BIAS

BIASSET

BIASMON

GND

GND

MODEN

RTEN

N.C.

N.C.