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MAX555 Datasheet(PDF) 2 Page - Maxim Integrated Products |
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MAX555 Datasheet(HTML) 2 Page - Maxim Integrated Products |
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2 / 12 page ![]() 300Msps, 12-Bit DAC with Complementary Voltage Outputs 2 _______________________________________________________________________________________ ABSOLUTE MAXIMUM RATINGS ELECTRICAL CHARACTERISTICS (AVEE = DVEE = -5.2V, VREF = 1.000V, TMIN to TMAX = 0°C to +70°C, unless otherwise noted.) (Note 2.) Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Note 1: Typical thermal resistance, junction-to-case R θJC = 28°C/W. See Package Information. Analog Supply Voltage (AVEE) .................................-7V to +0.3V Digital Supply Voltage (DVEE) ..................................-7V to +0.3V Digital Input Voltage (D0–D11) ...................................-5.5V to 0V Reference Input Voltage (VIN) .................................0V to +1.25V Reference Input Current....................................0mA to +1.56mA Output Compliance Voltage (VOC)......................-1.25V to +1.0V Output Common-Mode Voltage (VCM) ................-0.25V to +1.0V Continuous Power Dissipation (TA = +70°C) (without additional heatsink) ..............................................1.3W Operating Temperature Range...............................0°C to +70°C Junction Temperature Range (Note 1) .................0°C to +150°C Storage Temperature Range .............................-65°C to +150°C Lead Temperature (soldering, 10sec) .............................+300°C VREF = 1.000V, current out, into virtual ground, end-point linearity Major carry, TA = +25°C 10% to 90%, TA = +25°C 90% to 10%, TA = +25°C VREF = 1.000V, voltage out, VOUT/VIN (Note 3) ±0.024% FSR, 1LSB change D0–D11 = logic 1, VREF = 1.000V, measured at VOUT ±0.1% FSR CONDITIONS ns 15 Settling Time 4 % Full Scale -0.05 ±0.01 0.05 DLE2 Differential Linearity Error -0.012 ±0.003 0.012 DLE1 pVs 5.6 Glitch Energy ps 450 tRISE Rise Time ps 510 tFALL Fall Time % Full Scale -1.0 ±0.2 1.0 EG Absolute Gain Error Guaranteed 12-Bit Monotonicity µA 40 100 IOS Output Offset Current UNITS MIN TYP MAX SYMBOL PARAMETER VOUT VOUT VREF = 1.000V, current out, into virtual ground, end-point linearity VOUT % Full Scale -0.05 ±0.01 0.05 ILE2 Integral Linearity Error VOUT -0.012 ±0.006 0.012 ILE1 D0–D11 = logic 0, VREF = 0V, measured at VOUT µA 350 ILEAK Output Leakage Current fOUT = 5MHz, fCLK = 50MHz 70 fOUT = 20MHz, fCLK = 100MHz fOUT = 10MHz, fCLK = 50MHz 65 70 fOUT = 30MHz, fCLK = 200MHz fOUT = 30MHz, fCLK = 100MHz 56 60 fOUT = 40MHz, fCLK = 200MHz 53 dBc fOUT = 40MHz, fCLK = 250MHz 52 fOUT = 40MHz, fCLK = 300MHz fOUT = 50MHz, fCLK = 250MHz 52 51 fOUT = 50MHz, fCLK = 300MHz Spurious-Free Dynamic Range 51 nV √Hz Bits 0–11 high, TA = +25°C 10.6 Output Noise DC ACCURACY TIME-DOMAIN PERFORMANCE (Note 4) DYNAMIC PERFORMANCE (Notes 4, 5) |
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