DRV8701

SLVSCX5B – MARCH 2015 – REVISED JULY 2015

www.ti.com

6.4 Thermal Information

DRV8701

RGE (VQFN)

UNIT

24 PINS

Junction-to-ambient thermal resistance

34.8

°C/W

Junction-to-case (top) thermal resistance

37.1

°C/W

Junction-to-board thermal resistance

12.2

°C/W

Junction-to-top characterization parameter

0.6

°C/W

Junction-to-board characterization parameter

12.2

°C/W

Junction-to-case (bottom) thermal resistance

3.7

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6

Submit Documentation Feedback

Copyright © 2015, Texas Instruments Incorporated

Product Folder Links: DRV8701