| Electronic Components Datasheet Search |
|
LP3873 Datasheet(PDF) 15 Page - Texas Instruments |
|
|
|
|||||||||||||||||||||||||||||
LP3873 Datasheet(HTML) 15 Page - Texas Instruments |
|
15 / 24 page ![]() LP3873, LP3876 www.ti.com SNVS220E – NOVEMBER 2002 – REVISED APRIL 2013 Figure 25. θJA vs Copper (1 Ounce) Area for DDPAK/TO-263 package As shown in the figure, increasing the copper area beyond 1 square inch produces very little improvement. The minimum value for θJA for the DDPAK/TO-263 package mounted to a PCB is 32°C/W. Figure 26 shows the maximum allowable power dissipation for DDPAK/TO-263 packages for different ambient temperatures, assuming θJA is 35°C/W and the maximum junction temperature is 125°C. Figure 26. Maximum power dissipation vs ambient temperature for DDPAK/TO-263 package Copyright © 2002–2013, Texas Instruments Incorporated Submit Documentation Feedback 15 Product Folder Links: LP3873 LP3876 |
|
|
Link URL |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link to Datasheet | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |