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TC1307 Datasheet(PDF) 8 Page - Microchip Technology |
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TC1307 Datasheet(HTML) 8 Page - Microchip Technology |
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8 / 28 page ![]() TC1307 DS21702A-page 8 2002 Microchip Technology Inc. Note: Unless otherwise indicated, VIN = 3.8V, CIN = 10 µF ceramic (X5R), COUT = 1 µF ceramic (X5R), ILOAD = 100 µA, SELECT12 = NC, SELECT34 = VIN, SHDN1/2/3/4 = VIN, TA = 25°C. Junction temperature (TJ) is approximated by soaking the device under test at an ambient temperature equal to the desired Junction temperature. The test time is small enough such that the rise in the Junction temperature over the Ambient temperature is not significant. FIGURE 2-19: Line Step Response. FIGURE 2-20: Line Step Response. FIGURE 2-21: Power Supply Rejection Ratio vs. Ripple Voltage Frequency. FIGURE 2-22: Power Supply Rejection Ratio vs. Ripple Voltage Frequency. FIGURE 2-23: Output Noise. FIGURE 2-24: Output Noise. 0 10 20 30 40 50 60 70 1.0E+01 1.0E+02 1.0E+03 1.0E+04 1.0E+05 1.0E+06 Ripple Voltage Frequency (Hz) VIN = 4.1V VOUT = 2.8V COUT = 1 µF Ceramic ILOAD = 100 mA 0 10 20 30 40 50 60 70 1.0E+01 1.0E+02 1.0E+03 1.0E+04 1.0E+05 1.0E+06 Ripple Voltage Frequency (Hz) VIN = 4.1V VOUT = 2.8V COUT = 10µF Ceramic ILOAD = 100 mA |
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