Data Sheet

13

Rev.1.01, 2015-10-23

IFX52001

Package Outlines

6

Package Outlines

Figure 6

PG-DSO-8 (exposed pad) Outline and Recommended Footprint for Reflow Soldering

Green Product

To meet the world-wide customer requirements for environmentally friendly products and to be compliant

with government regulations the device is available as a green product. Green products are RoHS-Compliant

(i.e Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020).

PG-DSO-8-27-FP V01

5.69

1.31

2.65

PG-DSO-8-27-PO V01

14

85

8

14

5

8x

2)

M

0.2

D

C A-B

1.27

C

0.08

Seating Plane

C

A

B

1)

A-B

C

0.1

2x

3) JEDEC reference MS-012 variation BA

1) Does not include plastic or metal protrusion of 0.15 max. per side

2) Dambar protrusion shall be maximum 0.1 mm total in excess of lead width

Bottom View

±0.2

3

0.2

±0.2

D

6

M

D 8x

1)

0.1

0.35 x 45˚

CD 2x

Index Marking

For further information on alternative packages, please visit our website:

http://www.infineon.com/packages

.

Dimensions in mm