LM2767 datasheet(4/21 Pages) TI

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LM2767

SNVS069D – FEBRUARY 2000 – REVISED AUGUST 2015

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

Supply voltage (V+ to GND, or V+ to VOUT)

5.8

VOUT continuous output current

Output short-circuit duration to GND(3)

sec

Continuous power dissipation (TA = 25°C)

(4)

400

TJMax

(4)

150

°C

Storage temperature, Tstg

−65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

If Military/Aerospace specified devices are required, contact the TI Sales Office/ Distributors for availability and specifications.

(3)

VOUT may be shorted to GND for one second without damage. For temperatures above 85°C, VOUT must not be shorted to GND or

device may be damaged.

(4)

The maximum allowable power dissipation is calculated by using PDMax = (TJMax − TA)/RθJA, where TJMax is the maximum junction

temperature, TA is the ambient temperature, and RθJA is the junction-to-ambient thermal resistance of the specified package.

6.2 ESD Ratings

VALUE

UNIT

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

Electrostatic

V(ESD)

discharge

Machine model (CDM), per JEDEC specification JESD22-C101(2)

±200

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Junction temperature

−40

100

°C

Ambient temperature

−40

°C

Lead temperature (soldering, 10 sec.)

240

°C

6.4 Thermal Information

LM2767

THERMAL METRIC(1)

DBV (SOT-23)

UNIT

5 PINS

RθJA

Junction-to-ambient thermal resistance

210

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

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