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LM5039 Datasheet(PDF) 16 Page - Texas Instruments |
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LM5039 Datasheet(HTML) 16 Page - Texas Instruments |
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16 / 33 page ![]() Maximum Duty Cycle = TS 2 TS - T1 1 LM5039 SNVS621D – FEBRUARY 2010 – REVISED MARCH 2013 www.ti.com The LM5039 can be synchronized to an external clock by applying a narrow pulse to the RT pin. The external clock must be at least 10% higher than the free-running oscillator frequency set by the RT resistor. If the external clock frequency is less than the RT resistor programmed frequency, the LM5039 will ignore the synchronizing pulses. The synchronization pulse width at the RT pin must range between 15ns to 150ns. The clock signal should be coupled into the RT pin through a 100 pF capacitor. When the synchronizing pulse transitions low-to- high (rising edge), the voltage at the RT pin must be driven to exceed 3.2V volts from its nominal 2 VDC level. During the clock signal’s low time, the voltage at the RT pin will be clamped at 2 VDC by an internal regulator. The output impedance of the RT regulator is approximately 100 Ω. The RT resistor is always required, whether the oscillator is free running or externally synchronized. Gate Driver Outputs (HO & LO) The LM5039 provides two alternating gate driver outputs, the floating high side gate driver HO and the ground referenced low side driver LO. Each driver is capable of sourcing 1.25A and sinking 2A peak. The HO and LO outputs operate in an alternating manner, at one-half the internal oscillator frequency. The LO driver is powered directly by the VCC regulator. The HO gate driver is powered from a bootstrap capacitor connected between HB and HS. An external diode connected between VCC (anode pin) and HB (cathode pin) provides the high side gate driver power by charging the bootstrap capacitor from VCC when the switch node (HS pin) is low. When the high side MOSFET is turned on, HB rises to a peak voltage equal to VVCC + VHS where VHS is the switch node voltage. The HB and VCC capacitors should be placed close to the pins of the LM5039 to minimize voltage transients due to parasitic inductances since the peak current sourced to the MOSFET gates can exceed 1.25A. The recommended value of the HB capacitor is 0.01 µF or greater. A low ESR / ESL capacitor, such as a surface mount ceramic, should be used to prevent voltage droop during the HO transitions. The maximum duty cycle for each output is equal to or slightly less than 50% due to a programmed sync rectifier delay. The programmed sync rectifier delay is determined by the DLY pin resistor. If the COMP pin is open circuit, the outputs will operate at maximum duty cycle. The maximum duty cycle for each output can be calculated with the following equation: where • TS is the period of one complete cycle for either the HO or LO outputs • T1 is the programmed sync rectifier delay (4) For example, if the oscillator frequency is 200 kHz, each output will cycle at 100 kHz (TS = 10 µs). Using no programmed delay, the maximum duty cycle at this frequency is calculated to be 50%. Using a programmed sync rectifier delay of 100 ns, the maximum duty cycle is reduced to 49%. Because there is no fixed deadtime in LM5039, it is recommended that the delay pin resistor be not less than 10k. Internal delays, which are not specified, are the only protection against cross conduction if the programmed delay is zero, or very small. 16 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated Product Folder Links: LM5039 |
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