BUT11AF datasheet(4/8 Pages) ONSEMI

4 / 8 page

BUT11AF

http://onsemi.com

TEST CONDITIONS FOR ISOLATION TESTS*

MOUNTED

FULLY ISOLATED

PACKAGE

LEADS

HEATSINK

0.110″ MIN

Figure 7. Screw or Clip Mounting Position

for Isolation Test Number 1

*Measurement made between leads and heatsink with all leads shorted together.

CLIP

MOUNTED

FULLY ISOLATED

PACKAGE

LEADS

HEATSINK

CLIP

0.107″ MIN

MOUNTED

FULLY ISOLATED

PACKAGE

LEADS

HEATSINK

0.107″ MIN

Figure 8. Clip Mounting Position

for Isolation Test Number 2

Figure 9. Screw Mounting Position

for Isolation Test Number 3

MOUNTING INFORMATION

4-40 SCREW

PLAIN WASHER

HEATSINK

COMPRESSION WASHER

NUT

CLIP

HEATSINK

Laboratory tests on a limited number of samples indicate, when using the screw and compression washer mounting technique, a screw

torque of 6 to 8 in . lbs is sufficient to provide maximum power dissipation capability. The compression washer helps to maintain a constant

pressure on the package over time and during large temperature excursions.

Destructive laboratory tests show that using a hex head 4–40 screw, without washers, and applying a torque in excess of 20 in . lbs will

cause the plastic to crack around the mounting hole, resulting in a loss of isolation capability.

Additional tests on slotted 4–40 screws indicate that the screw slot fails between 15 to 20 in . lbs without adversely affecting the package.

However, in order to positively ensure the package integrity of the fully isolated device, ON Semiconductor does not recommend exceeding

10 in . lbs of mounting torque under any mounting conditions.

Figure 10. Typical Mounting Techniques

for Isolated Package

BUT11AF Datasheet(PDF) 4 Page - ON Semiconductor

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