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100355 Datasheet(PDF) 5 Page - National Semiconductor (TI) |
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100355 Datasheet(HTML) 5 Page - National Semiconductor (TI) |
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5 / 10 page ![]() Military Version AC Electrical Characteristics V EE = −4.2V to −5.7V, VCC = VCCA = GND Symbol Parameter T C = −55˚C T C = +25˚C T C = +125˚C Units Conditions Notes Min Max Min Max Min Max t PLH Propagation Delay t PHL D na–Dnd to Output 0.40 2.30 0.50 2.20 0.50 2.60 ns (Transparent Mode) t PLH Propagation Delay Figures 1, 2 (Notes 8, 9, 10) t PHL S 0,S1 to Output 0.60 3.00 0.80 2.70 0.80 3.20 ns (Transparent Mode) t PLH Propagation Delay 0.50 2.60 0.60 2.30 0.70 2.70 ns t PHL E 1,E2 to Output t PLH Propagation Delay 0.60 2.80 0.70 2.60 0.70 2.90 ns Figures 1, 3 (Notes 8, 9, 10) t PHL MR to Output t TLH Transition Time 0.40 1.90 0.40 1.90 0.40 1.90 ns Figures 1, 2 (Note 11) t THL 20% to 80%,80% to 20% t S Setup Time D na–Dnd 0.90 0.90 0.90 ns Figure 4 (Note 11) S 0,S1 2.40 2.40 2.40 MR (Release Time) 1.50 1.50 1.50 Figure 3 t H Hold Time D na–Dnd 0.40 0.40 0.40 ns Figure 4 (Note 11) S 0,S1 0.00 0.00 0.00 t pw (L) Pulse Width LOW E 1,E2 2.00 2.00 2.00 ns Figure 2 (Note 11) t pw (H) Pulse Width HIGH MR 2.00 2.00 2.00 ns Figure 3 (Note 11) Note 8: F100K 300 Series cold temperature testing is performed by temperature soaking (to guarantee junction temperature equals −55˚C), then testing immediately without allowing for the junction temperature to stabilize due to heat dissipation after power-up. This provides “cold start” specs which can be considered a worst case condition at cold temperatures. Note 9: Screen tested 100% on each device at +25˚C, Temperature only, Subgroup A9. Note 10: Sample tested (Method 5005, Table 1) on each Mfg. lot at +25˚, Subgroup A9, and at +125˚C, and −55˚C Temp., Subgroups A10 & A11. Note 11: Not tested at +25˚C, +125˚C and −55˚C Temperature (design characterization data). 5 www.national.com |
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