AC Electrical Characteristics

V

Symbol

Parameter

T

T

T

Units

Conditions

Notes

Min

Max

Min

Max

Min

Max

t

PLH

Propagation Delay

0.3

2.40

0.4

2.20

0.40

2.70

ns

t

PHL

E

t

PLH

Propagation Delay

0.30

2.60

0.40

2.40

0.40

2.90

ns

t

PHL

A

(Notes 9, 10,

11)

t

PLH

Propagation Delay

0.30

2.60

0.40

2.40

0.40

2.40

ns

Figures 1, 2

t

PHL

H

t

PLH

Propagation Delay

0.40

3.10

0.60

2.80

0.70

3.70

ns

t

PHL

M to Output

t

TLH

Transition Time

0.30

1.60

0.30

1.60

0.30

1.60

ns

(Note 12)

t

THL

20% to 80%,80% to 20%

Note 9: F100K 300 Series cold temperature testing is performed by temperature soaking (to guarantee junction temperature equals −55˚C), then testing immediately

without allowing for the junction temperature to stabilize due to heat dissipation after power-up. This provides “cold start” specs which can be considered a worst case

condition at cold temperatures.

Note 10: Screen tested 100% on each device at +25˚C, temperature only, Subgroup A9.

Note 11: Sample tested (Method 5005, Table I) on each Mfg. lot at +25˚C, Subgroup A9, and at +125˚C, and −55˚C Temp., Subgroups A10 and A11.

Note 12: Not tested at +25˚C, +125˚C and −55˚C Temperature (design characterization data).

Test Circuit

DS100311-7

Notes:

L1 and L2 = equal length 50

Ω impedance lines

All unused outputs are loaded with 50

Ω to GND

Pin numbers shown are for flatpak; for DIP see logic symbol

FIGURE 1. AC Test Circuit

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