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2N7002H Datasheet(PDF) 2 Page - Diodes Incorporated |
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2N7002H Datasheet(HTML) 2 Page - Diodes Incorporated |
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2 / 6 page ![]() 2N7002H Document number: DS38025 Rev. 1 - 2 2 of 6 www.diodes.com July 2015 © Diodes Incorporated 2N7002H Maximum Ratings (@TA = +25°C, unless otherwise specified.) Characteristic Symbol Value Units Drain-Source Voltage VDSS 60 V Gate-Source Voltage Continuous Pulsed VGSS ±20 ±40 V Continuous Drain Current (Note 5) VGS = 10V Steady State TA = +25°C TA = +85°C TA = +100°C ID 170 120 105 mA Continuous Drain Current (Note 6) VGS = 10V Steady State TA = +25°C TA = +85°C TA = +100°C ID 210 150 135 mA Maximum Body Diode Forward Current (Note 6) Continuous Pulsed IS 0.5 2 A Pulsed Drain Current (10µs pulse, duty cycle = 1%) IDM 500 mA Thermal Characteristics (@TA = +25°C, unless otherwise specified.) Characteristic Symbol Value Units Total Power Dissipation (Note 5) PD 370 mW (Note 6) 510 Thermal Resistance, Junction to Ambient (Note 5) RJA 341 °C/W (Note 6) 249 Operating and Storage Temperature Range TJ, TSTG -55 to +150 °C Electrical Characteristics (@TA = +25°C, unless otherwise specified.) Characteristic Symbol Min Typ Max Unit Test Condition OFF CHARACTERISTICS (Note 7) Drain-Source Breakdown Voltage BVDSS 60 V VGS = 0V, ID = 10µA Zero Gate Voltage Drain Current IDSS 1.0 µA VDS = 60V, VGS = 0V Gate-Body Leakage IGSS ±100 nA VGS = ±20V, VDS = 0V ON CHARACTERISTICS (Note 7) Gate Threshold Voltage VGS(th) 2.0 3.0 V VDS = VGS, ID = 250µA Static Drain-Source On-Resistance RDS (ON) 3.0 7.5 Ω VGS = 5.0V, ID = 0.05A Diode Forward Voltage VSD 0.78 1.5 V VGS = 0V, IS = 115mA DYNAMIC CHARACTERISTICS (Note 8) Input Capacitance Ciss 26 pF VDS = 25V, VGS = 0V f = 1.0MHz Output Capacitance Coss 2.8 pF Reverse Transfer Capacitance Crss 2.1 pF Total Gate Charge (VGS = 4.5V) Qg 352 pC VDS = 10V, ID = 250mA Gate-Source Charge Qgs 203 Gate-Drain Charge Qgd 123 Turn-On Delay Time tD(on) 3.7 ns VDD = 30V, ID = 0.2A, RL = 150Ω, VGEN = 10V, RGEN = 25Ω Turn-On Rise Time tr 2.9 Turn-Off Delay Time tD(off) 8.4 Turn-Off Fall Time tf 4.7 Body Diode Reverse Recovery Time trr - 9.3 - ns IS = 0.5A, dI/dt = 100A/μs Body Diode Reverse Recovery Charge Qrr - 3.5 - nC IS = 0.5A, dI/dt = 100A/μs Notes: 5. Device mounted on FR-4 PCB, with minimum recommended pad layout. 6. Device mounted on 1” x 1” FR-4 PCB with high coverage 2oz. Copper, single sided. 7. Short duration pulse test used to minimize self-heating effect. 8. Guaranteed by design. Not subject to product testing. |
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