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DMN2005UPS Datasheet(PDF) 2 Page - Diodes Incorporated |
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DMN2005UPS Datasheet(HTML) 2 Page - Diodes Incorporated |
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2 / 7 page ![]() POWERDI is a registered trademark of Diodes Incorporated. DMN2005UPS Document number: DS37844 Rev. 2 - 2 2 of 7 www.diodes.com August 2015 © Diodes Incorporated DMN2005UPS Maximum Ratings (@TA = +25°C, unless otherwise specified.) Characteristic Symbol Value Unit Drain-Source Voltage VDSS 20 V Gate-Source Voltage VGSS ±12 V Continuous Drain Current (Note 6) VGS = 10V Steady State TA = +25°C TA = +70°C ID 20 15 A Continuous Drain Current (Note 6) VGS = 10V Steady State TC = +25°C TC = +70°C ID 100 88 A Pulsed Drain Current (380 μs Pulse, Duty Cycle = 1%) IDM 150 A Maximum Continuous Body Diode Forward Current (Mounted on Infinite Heatsink) IS 150 A Avalanche Current (Note 7) L=0.2mH IAS 36 A Avalanche Energy (Note 7) L=0.2mH EAS 133 mJ Thermal Characteristics Characteristic Symbol Value Unit Total Power Dissipation (Note 5) PD 1.5 W Thermal Resistance, Junction to Ambient (Note 5) Steady state RJA 98 °C/W t<10s 83 Total Power Dissipation (Note 6) PD 3.0 W Thermal Resistance, Junction to Ambient (Note 6) Steady state RJA 51 °C/W t<10s 43 Thermal Resistance, Junction to Case RJC 1.5 Operating and Storage Temperature Range TJ, TSTG -55 to +150 °C Electrical Characteristics (@TA = +25°C, unless otherwise specified.) Characteristic Symbol Min Typ Max Unit Test Condition OFF CHARACTERISTICS (Note 8) Drain-Source Breakdown Voltage BVDSS 20 — — V VGS = 0V, ID = 250μA Zero Gate Voltage Drain Current TJ = +25°C IDSS — — 1 µA VDS = 20V, VGS = 0V Gate-Source Leakage IGSS — — ±100 nA VGS = ±12V, VDS = 0V ON CHARACTERISTICS (Note 8) Gate Threshold Voltage VGS(TH) 0.4 0.7 1.2 V VDS = VGS, ID = 250μA Static Drain-Source On-Resistance RDS(ON) — — 4.6 m Ω VGS = 4.5V, ID = 13.5A — — 8.7 VGS = 2.5V, ID = 13.5A Diode Forward Voltage VSD — 0.8 1.1 V VGS = 0V, IS = 27A DYNAMIC CHARACTERISTICS (Note 9) Input Capacitance Ciss — 5337 — pF VDS = 10V, VGS = 0V, f = 1MHz Output Capacitance Coss — 560 — pF Reverse Transfer Capacitance Crss — 505 — pF Gate Resistance Rg — 0.7 — Ω VDS = 0V, VGS = 0V, f = 1MHz Total Gate Charge (VGS = 4.5V) Qg — 60 — nC VDS = 16V, ID = 27A Total Gate Charge (VGS = 10V) Qg — 142 — nC Gate-Source Charge Qgs — 7 — nC Gate-Drain Charge Qgd — 11 — nC Turn-On Delay Time tD(ON) — 12.4 — ns VGS = 5V, VDS = 10V, RG = 4.7Ω, ID = 13.5A Turn-On Rise Time tR — 29.8 — ns Turn-Off Delay Time tD(OFF) — 117 — ns Turn-Off Fall Time tF — 52 — ns Body Diode Reverse Recovery Time tRR — 17.8 — ns IF = 13.5A, di/dt = 100A/μs Body Diode Reverse Recovery Charge QRR — 8.6 — nC IF = 13.5A, di/dt = 100A/μs Notes: 5. Device mounted on FR-4 PC board, with minimum recommended pad layout, single sided. 6. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal bias to bottom layer 1inch square copper plate. 7. IAS and EAS ratings are based on low frequency and duty cycles to keep TJ = +25°C. 8. Short duration pulse test used to minimize self-heating effect. 9. Guaranteed by design. Not subject to product testing. |
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