INA188

SBOS632 – SEPTEMBER 2015

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

±20

Supply

V

40 (single supply)

Voltage

Current

±10

mA

(V–) – 0.5

(V+) + 0.5

V

Continuous

–55

150

Temperature

150

°C

–65

150

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Input pins are diode-clamped to the power-supply rails. Input signals that can swing more than 0.3 V beyond the supply rails must be

current limited to 10 mA or less.

(3)

Short-circuit to ground.

6.2 ESD Ratings

VALUE

UNIT

±2500

Electrostatic discharge

V

±1000

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Supply voltage

4 (±2)

36 (±18)

V

Specified temperature

-40

125

°C

6.4 Thermal Information

INA188

D (SOIC)

DRG (WSON)

UNIT

8 PINS

8 PINS

Junction-to-ambient thermal resistance

125

145

°C/W

Junction-to-case (top) thermal resistance

80

75

°C/W

Junction-to-board thermal resistance

68

39

°C/W

Junction-to-top characterization parameter

32

14

°C/W

Junction-to-board characterization parameter

68

105

°C/W

Junction-to-case (bottom) thermal resistance

N/A

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

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