PCM1681, PCM1681-Q1

SLES211C – FEBRUARY 2008 – REVISED JULY 2015

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Table of Contents

8.4

Device Functional Modes........................................ 24

1

Features .................................................................. 1

8.5

Programming........................................................... 24

2

Applications ........................................................... 1

8.6

Register Maps ......................................................... 26

3

Description ............................................................. 1

9

Application and Implementation ........................ 32

4

Revision History..................................................... 2

9.1

Application Information............................................ 32

5

Description (continued)......................................... 3

9.2

Typical Application ................................................. 32

6

Pin Configuration and Functions ......................... 4

10

Power Supply Recommendations ..................... 34

7

Specifications......................................................... 5

11

Layout................................................................... 35

7.1

Absolute Maximum Ratings ..................................... 5

11.1

Layout Guidelines ................................................. 35

7.2

ESD Ratings: PCM1681 ........................................... 5

11.2

Layout Example .................................................... 35

7.3

ESD Ratings: PCM1681-Q1 ..................................... 5

12

Device and Documentation Support ................. 36

7.4

Recommended Operating Conditions ....................... 6

12.1

Device Support .................................................... 36

7.5

Thermal Information .................................................. 6

12.2

Documentation Support ........................................ 36

7.6

Electrical Characteristics........................................... 7

12.3

Related Links ........................................................ 36

7.7

Interface Timing Requirements ................................. 9

12.4

Trademarks ........................................................... 36

7.8

Typical Characteristics ............................................ 10

12.5

Electrostatic Discharge Caution ............................ 36

8

Detailed Description ............................................ 14

12.6

Glossary ................................................................ 36

8.1

Overview ................................................................. 14

13

Mechanical, Packaging, and Orderable

8.2

Functional Block Diagram ....................................... 14

Information ........................................................... 36

8.3

Feature Description................................................. 15

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision B (June 2008) to Revision C

Page

•

Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional

Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device

and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1

Changes from Revision A (June 2008) to Revision B

Page

•

Added new device grade PCM1681-Q1 ................................................................................................................................. 1

•

Changed device names in Operating Free-Air Temperature row of the Recommended Operating Conditions table ........... 6

•

Changed device names in Operating Temperature row of Temperature Range section in the Electrical

Characteristics table ............................................................................................................................................................... 8

•

Added third paragraph to PCB Layout Guidelines section ................................................................................................... 35

Changes from Original (February 2008) to Revision A

Page

•

Added last sub-level bullet to Features ................................................................................................................................. 1

•

Added first two bullets to Applications ................................................................................................................................... 1

•

Changed last sentence in Description ................................................................................................................................... 1

•

Added last row to Recommended Operating Conditions table............................................................................................... 6

•

Added second row to Temperature Range section of the Electrical Characteristics table .................................................... 8

2

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