AH5773

Document number: DS35444 Rev. 2 - 2

11 of 17

www.diodes.com

January 2015

© Diodes Incorporated

AH5773

Thermal Performance

MSOP-8EP Power Dissipation De-rating Curve 1 (Note 22)

-40

0

25

50

60

70

80

85

90

95

100

105

110

120

125

130

140

150

959

872

785

698

523

436

349

174

0

Note 22:

MSOP-8EP exposed pad soldered to minimum recommended landing pads (see Package Outline Dimension section) on a 2in x 2in two-layer 2oz copper

FR4 PCB (1.6mm thickness) with four thermal vias in the exposed PAD to the copper flood on the bottom layer.

MSOP-8EP Power Dissipation De-rating Curve 2 (Note 23)

-40

0

25

50

60

70

80

85

90

95

100

105

110

120

125

130

140

150

710

710

710

568

511

454

398

369

341

312

284

256

227

170

142

114

57

0

Note 23:

MSOP-8EP exposed pad soldered to minimum recommended landing pads (see Package Outline Dimension section) on a 1in x1in 2oz copper FR4

PCB (1.6mm thickness) with no thermal vias in the exposed PAD or any copper flood connecting to the landing pattern or on the bottom layer.

0

250

500

750

1000

1250

1500

1750

2000

2250

2500

-40

-20

0

20

40

60

80

100

120

140

160

Temperature ( C)

MSOP8-EP Thermal Derating Curve

0

100

200

300

400

500

600

700

800

-40

-20

0

20

40

60

80

100

120

140

160

Temperature ( C)

MSOP8-EP Thermal Derating Curve

MSOP-8EP Thermal Derating Curve

MSOP-8EP Thermal Derating Curve