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Announcing significant improvements to our high-performance contact system. Using our proven Interposer Elastomer Technology,

the new CORE feature internally controls compression to ensure stability with extremely low resistance values and much longer

contact element life. (See Interposer Contact System Life on following page).

Low interconnect parasitics make these sockets an ideal choice for device characterization or high-volume production testing of

devices, such as power amplifiers, mixers, highly integrated RF ICs, and microwave devices.

Insertion Loss of -1dB @ 40GHz

Return Loss of -15dB @ 22GHz

Interposer contact system with very short interconnects (available in 1.0mm or

0.6mm thickness) enhance adjacent channel power and noise sensitivity

measurements.

Long-Life Hi-Frequency Sockets for BGA, LGA,

QFN, MLCC, µBGA and Bumped Die Devices

Interposer footprint lets the PCB

designer locate impedance matching

network components within 1mm of

device pads.

CONTACT SET

INTERPOSER

Top Side

Bottom Side

Column Array

Cross Section

Tips Pierce DUT

Tails Compress Columns Elastomer Matrix Compliant Buttons

Ag Particles

24005

Rev. 1.2

1 of 2

ORDERING INFORMATION

This material can be ordered with

ANY Aries RF/CSP Sockets

Hand Test

Automation

QFN Footprint

Ideally Suited for RFIC and Microwave IC Development & Test

Interposer Contact System – AR200 and AR300 Series Test Sockets

FULL-ARRAY SHOWN AS AN EXAMPLE; YOUR SPECIFIC DEVICE

PATTERN/FOOTPRINT WILL BE SUPPLIED WHEN ORDERED.