24005 datasheet(2/2 Pages) ARIES

2 / 2 page

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High-Performance Interposer Contact Technology

Suitable for Manual & Automated High-Volume Production Test

Interposer Contact System Life: QFN 0.5mm Pitch, 1.0mm Full Height

AR200 Series: 1.0mm Full Height

AR300 Series: 0.6mm Half Height

Specifications

(measured in a 0.5mm pitch environment, GSG)

(estimated 0.5mm pitch environment, GSG)

Insertion Loss S21: -1dB @ 40GHz

Insertion Loss S21: -1dB @ >40GHz

Return Loss S11 thru: -15dB @ 22GHz

Return Loss S11 thru: -15dB @ >22GHz

Self Inductance: 0.33nH

Self Inductance: <0.15nH

Mutual Capacitance: <0.05pF

Mutual Capacitance: <0.02pF

Operating Temperature: -55°C to 155°C

Contact Resistance: <25mΩ

Current Rating: 4A per lead with a 14°C rise

Contact Length (compressed): 1.04mm

Contact Length (compressed): 0.63mm

Contact Force/Travel: 25-45 gf/0.4mm travel

Contact Force/Travel: 25-45 gf/0.28mm travel

Contact Set Life: >2,000,000 insertions

Interposer Elastomer Life: >500,000 insertions

Interposer Elastomer Conductive Columns, available in 2 Standard Heights with

Standard & Custom Pitches from 1.27mm to 0.4mm

Long-Life Hi-Frequency Sockets for BGA, LGA,

QFN, MLCC, µBGA and Bumped Die Devices

24005

Rev. 1.2

2 of 2

24005 Datasheet(PDF) 2 Page - Aries Electronics, Inc.