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Data Sheet 4416

The only controlled copy of this Data Sheet is the electronic read-only version located on the Cooper Bussmann Network Drive. All other copies of this document are by definition uncontrolled. This bulletin is

intended to clearly present comprehensive product data and provide technical information that will help the end user with design applications. Cooper Bussmann reserves the right, without notice, to change

design or construction of any products and to discontinue or limit distribution of any products. Cooper Bussmann also reserves the right to change or update, without notice, any technical information con-

tained in this bulletin. Once a product has been selected, it should be tested by the user in all possible applications.

Life Support Policy: Cooper Bussmann does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life sup-

port systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result

in significant injury to the user.

Product Characteristics

Operating Temperature

-40°C to 85°C with proper correction factor applied

Storage Temperature

-10°C to 40°C

Solderability

EIA-186-9E Method 9

High Frequency Vibration Test

Test-Withstands 10-55Hz per MIL-STD-202F, Method 201A

Endurance Test

IEC60127-3/4

Wave Soldering Parameters

• Reservoir Temperature: 260°C

• Time: Maximum 10 Seconds

Solder Reflow Profile

Recommended Hand-Solder Parameters

• Solder Iron Temperature: 350°C±5°C

• Heating Time: 5 seconds maximum

Note: These devices are not recommended for IR or Convection Reflow process.