Recommendation on PCB assembly

EMIF02-01OABRY

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DocID028302 Rev 1

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Recommendation on PCB assembly

3.1

Reflow profile

Figure 8.

Note:

Minimize air convection currents in the reflow oven to avoid component movement.

250

0

50

100

150

200

240

210

180

150

120

90

60

30

300

270

-6°C/s

240-245 °C

2 - 3 °C/s

Temperature (°C)

-2 °C/s

-3 °C/s

Time (s)

0.9 °C/s

60 sec

(90 max)