0

75

50

25

100

125

150

175

200

0

50

100

150

200

CaseTemperature

C

o

−

V

,

=3.6V

V

,V

=5.5V

CC1

CC2

ISO721, ISO721M, ISO722, ISO722M

www.ti.com

SLLS629L – JANUARY 2006 – REVISED OCTOBER 2015

9.3.4 Package Insulation Characteristics

PARAMETER

DESCRIPTIONS / TEST CONDITIONS

MIN

TYP

MAX

UNIT

D-8

4

L(101)

Shortest terminal-to-terminal distance through air

mm

DUB-8

6.1

D-8

4

Minimum external tracking

Shortest terminal-to-terminal distance across the

L(102)

mm

package surface

DUB-8

6.8

Tracking resistance (comparative

CTI

DIN EN 60112 (VDE 0303-11); IEC 60112

400

V

tracking index)

DTI

Distance through insulation

Minimum internal gap (internal clearance)

0.008

mm

Ω

Isolation resistance

Ω

100°C

Barrier capacitance

1

pF

Input-to-output

(1)

Creepage and clearance requirements are applied according to the specific equipment isolation standards of an application. Maintain

the creepage and clearance distance of a board design to ensure that the mounting pads of the isolator on the printed circuit board do

not reduce this distance.

Creepage and clearance on a printed circuit board become equal according to the measurement techniques shown in the Isolation

Glossary in the Related Documentation section. Techniques such as inserting grooves and/or ribs on a printed circuit board are used to

help increase these specifications.

9.3.5 Safety Limiting Values

Safety limiting intends to prevent potential damage to the isolation barrier upon failure of input or output circuitry.

A failure of the I/O can allow low resistance to ground or the supply, and without current limiting, dissipate

sufficient power to overheat the die and damage the isolation barrier, potentially leading to secondary system

failures.

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

100

Safety input, output, or supply current

mA

153

Maximum case temperature

150

°C

The safety-limiting constraint is the absolute maximum junction temperature specified in the absolute maximum

ratings table. The power dissipation and junction-to-air thermal impedance of the device installed in the

application hardware determines the junction temperature. The junction-to-air thermal resistance in the Thermal

Information table is that of a device installed in the JESD51-3, Low Effective Thermal Conductivity Test Board for

Leaded Surface Mount Packages and is conservative.

Figure 16.

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