Data Sheet

ADG5401

OUTLINE DIMENSIONS

Figure 29. 8-Lead Mini Small Outline Package [MSOP]

(RM-8)

Dimensions shown in millimeters

Figure 30. 8-Lead Lead Frame Chip Scale Package [LFCSP_WD]

2 mm × 3 mm Body, Very Very Thin, Dual Lead

(CP-8-4)

Dimensions shown in millimeters

ORDERING GUIDE

Temperature Range

Package Description

Package Option

Branding

ADG5401BRMZ

−40°C to +125°C

8-Lead Mini Small Outline Package [MSOP]

RM-8

S2M

ADG5401BRMZ-RL7

−40°C to +125°C

8-Lead Mini Small Outline Package [MSOP]

RM-8

S2M

ADG5401BCPZ-RL7

−40°C to +125°C

8-Lead Lead Frame Chip Scale Package [LFCSP_WD]

CP-8-4

BR

1

Z = RoHS Compliant Part.

COMPLIANT TO JEDEC STANDARDS MO-187-AA

6°

0°

0.80

0.55

0.40

4

8

1

5

0.65 BSC

0.40

0.25

1.10 MAX

3.20

3.00

2.80

COPLANARITY

0.10

0.23

0.09

3.20

3.00

2.80

5.15

4.90

4.65

PIN 1

IDENTIFIER

15° MAX

0.95

0.85

0.75

0.15

0.05

COPLANARITY

0.08

0.50

0.40

0.30

0.20 MIN

0.05 MAX

0.02 NOM

0.15 REF

0.50

PIN 1

INDICATOR

EXPOSED

PAD

BOTTOM VIEW

TOP VIEW

0.30

0.25

0.20

0.80

0.75

0.70

SEATING

PLANE

3.00 BSC

SIDE VIEW

1

4

8

5

2.00 BSC

INDEX

AREA

1.90

1.80

1.65

1.75

1.65

1.50

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

©2013–2015 Analog Devices, Inc. All rights reserved. Trademarks and

registered trademarks are the property of their respective owners.

D11728-0-1/15(A)

Rev. A | Page 17 of 17