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XC9141/XC9142

Series

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NOTE ON USE (Continued)

16) Instructions for pattern layouts

1.

GND pins.

2.

Please mount each external component as close to the IC as possible.

3.

Place external components as close to the IC as possible and use thick and short traces to reduce the circuit impedance.

4.

Make sure that the PCB GND traces are thick and wide as possible. GND voltage level fluctuation created by high ground current at

the time of switching may cause instability of the IC.

5.

＜

Example of pattern layout＞

SOT-25

PCB mounted

1st layer

2nd layer

USP-6C

PCB mounted

1st layer

2nd layer

WLP-6-01

PCB mounted

1st layer

2nd layer

6.

Note on mounting (WLP-6-01)

6-1. Mount pad design should be optimized for user's conditions.

6-2. Sn-AG-Cu is used for the package terminals. If eutectic solder is used, mounting reliability is decreased. Please do not

use eutectic solder paste.

6-3. When underfill agent is used to increase interfacial bonding strength, please take enough evaluation for selection. Some

underfill materials and applied conditions may decrease bonding reliability.

6-4. The IC has exposed surface of silicon material in the top marking face and sides so that it is weak against mechanical

damages. Please take care of handling to avoid cracks and breaks.

6-5. The IC has exposed surface of silicon material in the top marking face and sides. Please use the IC with keeping the circuit

open (avoiding short-circuit from the out).

6-6. Semi-transparent resin is coated on the circuit face of the package. Please be noted that the usage under strong lights may

affects device performance.