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XCL222 Datasheet(PDF) 11 Page - Torex Semiconductor |
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XCL222 Datasheet(HTML) 11 Page - Torex Semiconductor |
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11 / 20 page ![]() 11/20 XCL221/XCL222 Series ■ NOTE ON USE (Continued) 17. Please use within the power dissipation range below. Please also note that the power dissipation may changed by test conditions, the power dissipation figure shown is PCB mounted. Pd vs Operating Temperature Pakage Body Temperature vs Operating Temperature the power loss of micro DC/DC according to the following formula: power loss = VOUT×IOUT×((100/EFFI) – 1) (W) VOUT : Output Voltage (V) IOUT : Output Current (A) EFFI : Conversion Efficiency (%) Measurement Condition (Reference data) Condition: Mount on a board Ambient: Natural convection Soldering: Lead (Pb) free Board: Dimensions 40 x 40 mm (1600 mm2 in one side) Copper (Cu) traces occupy 50% of the board area In top and back faces Package heat-sink is tied to the copper traces Material: Glass Epoxy (FR-4) Thickness: 1.6mm Through-hole: 4 x 0.8 Diameter Evaluation Board (unit: mm) |
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