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HMC136 Datasheet(PDF) 4 Page - Hittite Microwave Corporation |
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HMC136 Datasheet(HTML) 4 Page - Hittite Microwave Corporation |
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4 / 4 page ![]() MICROWAVE CORPORATION 6 - 9 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order Online at www.hittite.com 6 HMC136 GaAs MMIC BI-PHASE MODULATOR, 4 - 8 GHz v01.0300 Outline Drawing Suggested TTL Driver for a Bi-Phase Modulator Notes 1. V AAlternates Between + 2.4 V dc ± I A = 2.4 - 0.6 = ± 5 mA 360 Ohm 2. HCT04 and HC04 are QMOS HEX Inverters. *R 1 =300 to 620 ± 2% Select R1 To Supply ±3 to ±6 mA to the IF Port. 2.2K TTL VCC GND GND VCC HCT04 HC04 .01 uF .01 uF -2.5 Vdc +2.5 Vdc +5 Vdc *R 1 MODULATOR I, Q PORTS HITTITE MODULATOR VA IA V Z = 2V 0.6V NOTES: 1. ALL DIMENSIONS ARE IN INCHES [MM]. 2. TYPICAL BOND PAD IS .004” SQUARE. 3. BOND PAD SPACING IS .006” CENTER TO CENTER. 4. BACKSIDE METALIZATION: GOLD. 5. BACKSIDE METAL IS GROUND. 6. BOND PAD METALIZATION: GOLD. 7. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS. |
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