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MA4SPS552 Datasheet(PDF) 1 Page - M/A-COM Technology Solutions, Inc. |
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MA4SPS552 Datasheet(HTML) 1 Page - M/A-COM Technology Solutions, Inc. |
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1 / 6 page ![]() SURMOUNTTM PIN Diode Rev. V3 MA4SPS552 1 1 M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support 1 Features Surface Mount Device No Wirebonds Required Rugged Silicon-Glass Construction Silicon Nitride Passivation Polymer Scratch Protection Ultra-Low Parasitic Capacitance and Inductance Higher Power Handling (Efficient Heat sinking) RoHS* Compliant Description The MA4SPS552 is a silicon-glass PIN diode chip fabricated with MACOM’s patented HMIC process. This device features two silicon pedestals embedded in a low loss glass. The diode is formed on the top of one pedestal and connections to the backside of the device are facilitated by making the pedestal sidewalls conductive. Selective backside metallization is applied producing a surface mount device. The topside is fully encapsulated with silicon nitride and has an additional polymer layer for scratch protection. These protective coatings prevent damage to the junction and the anode air-bridge during handling and assembly. These packageless devices are suitable for usage in moderate incident power (5 W CW) or higher incident peak power (200 W, 1 µs, 0.001 Duty) series, shunt, or series-shunt switches. Small parasitic inductance, 0.7 nH, and excellent RC constant (0.20 ps) make the devices ideal for TR switch and accessory switch circuits, where higher P1db and IP3 values are required. These diodes can also be used in π, T, Tapered Resistance, and Switched-Pad Attenuator Control Circuits for 50 Ω or 75 Ω systems. Ordering Information1 Part Number Package MA4SPS552 100 pc. die in carrier MADP-000552-12810T 3000 pc. pocket tape on reel A B C G D E F Package Dimensions2 INCHES MM DIM MIN MAX MIN MAX A 0.0207 0.0226 0.525 0.575 B 0.0108 0.0128 0.275 0.325 C 0.0040 0.0080 0.102 0.203 D 0.0075 0.0095 0.190 0.241 E 0.0032 0.004 0.081 0.101 F 0.0061 0.0081 0.155 0.205 G 0.0069 0.0089 0.175 0.225 2. Backside metal: 0.1 μm thick. * Restrictions on Hazardous Substances, European Union Directive 2011/65/EU. 1. Reference Application Note M513 for reel size information. |
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