REV. A

–4–

AD8330

ABSOLUTE MAXIMUM RATINGS

1

Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 V

Power Dissipation

RQ Package

2

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.62 W

CP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.67 W

Storage Temperature . . . . . . . . . . . . . . . . . . . –65

∞C to +105∞C

Operating Temperature Range . . . . . . . . . . . . –40

∞C to +85∞C

Lead Temperature (Soldering 60 sec) . . . . . . . . . . . . . . 300

∞C

NOTES

permanent damage to the device. This is a stress rating only and functional

operation of the device at these or any other conditions above those indicated

in the operational section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection. Although the

AD8330 features proprietary ESD protection circuitry, permanent damage may occur on devices

subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are

recommended to avoid performance degradation or loss of functionality.

ORDERING GUIDE

Model

Temperature Range

Package Description

Package Outline

AD8330ACP

–40ºC to +85ºC

Chip Scale Package

LFCSP

AD8330ACP-REEL

–40ºC to +85ºC

Chip Scale Package

LFCSP

AD8330ACP-REEL7

–40ºC to +85ºC

Chip Scale Package

LFCSP

AD8330ARQ

–40ºC to +85ºC

Thin Shrink SO

QSOP

AD8330ARQ-REEL

–40ºC to +85ºC

Thin Shrink SO

QSOP

AD8330ARQ-REEL7

–40ºC to +85ºC

Thin Shrink SO

QSOP