IR3101

6

www.irf.com

IC Driver

V

o

V

BUS

V

B

COM

9

11

8

1

6

2

3

5

V

CC

H

IN

L

IN

V

SS

IC Driver

V

o

V

BUS

V

B

COM

9

11

8

1

6

2

3

6

V

CC

H

IN

L

IN

V

SS

IC Driver

V

o

V

BUS

V

B

COM

9

11

8

1

6

2

3

5

V

CC

H

IN

L

IN

V

SS

M

BUS

BUS

IR3101

IR3101

IR3101

Typical Application Connection IR3101

1. Electrolytic bus capacitors should be mounted as close to the module bus terminals as possible to re-

duce ringing and EMI problems. Additional high frequency ceramic capacitor mounted close to the

module pins will further improve performance.

between these terminals is recommended and should be located very close to the module pins. Addi-

tional high frequency capacitors, typically 0.1

µF, are strongly recommended.

3. Low inductance shunt resistor should be used for phase leg current sensing. Similarly, the length of

the traces from the pin to the corresponding shunt resistor should be kept as small as possible.

4. Value of the bootstrap capacitors depends upon the switching frequency. Their selection should be

made based on IR design tip DN 98-2a or Figure 8.

5. Application conditions should guarantee minimum dead-time of 200ns