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DMP2007UFG Datasheet(PDF) 2 Page - Diodes Incorporated |
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DMP2007UFG Datasheet(HTML) 2 Page - Diodes Incorporated |
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2 / 7 page ![]() DMP2007UFG Document number: DS37943 Rev. 3 - 2 2 of 7 www.diodes.com October 2015 © Diodes Incorporated DMP2007UFG Maximum Ratings (@TA = +25°C, unless otherwise specified.) Characteristic Symbol Value Units Drain-Source Voltage VDSS -20 V Gate-Source Voltage VGSS ±12 V Continuous Drain Current (Note 5) VGS = -10V Steady State TA = +25°C TA = +70°C TC = +25°C ID -18.0 -14.5 -40 A Pulsed Drain Current (10 μs Pulse, Duty Cycle = 1%) IDM -80 A Maximum Continuous Body Diode Forward Current (Note 5) IS -2.2 A Avalanche Current L=0.1mH IAS -30 A Avalanche Energy L=0.1mH EAS 50 mJ Thermal Characteristics (@TA = +25°C, unless otherwise specified.) Characteristic Symbol Value Units Total Power Dissipation (Note 5) TA = +25°C PD 2.3 W TC = +25°C 41 Thermal Resistance, Junction to Ambient (Note 5) RθJA 58 °C/W (Note 6) 143 Thermal Resistance, Junction to Case RθJC 3.0 Operating and Storage Temperature Range TJ, TSTG -55 to +150 °C Electrical Characteristics (@TA = +25°C, unless otherwise specified.) Characteristic Symbol Min Typ Max Unit Test Condition OFF CHARACTERISTICS (Note 7) Drain-Source Breakdown Voltage BVDSS -20 — — V VGS = 0V, ID = -250µA Zero Gate Voltage Drain Current IDSS — — -1 µA VDS = -16V, VGS = 0V Gate-Source Leakage IGSS — — ±100 nA VGS = 12V, VDS = 0V ON CHARACTERISTICS (Note 7) Gate Threshold Voltage VGS(TH) -0.4 — -1.3 V VDS = VGS, ID = -250µA Static Drain-Source On-Resistance RDS(ON) — 4.4 5.5 m Ω VGS = -10V, ID = -15A — 4.9 7.0 VGS = -4.5V, ID = -15A — 6.5 9.0 VGS = -2.5V, ID = -10A Diode Forward Voltage VSD — -0.7 -1.2 V VGS = 0V, IS = -10A DYNAMIC CHARACTERISTICS (Note 8) Input Capacitance Ciss — 4,621 — pF VDS = -10V, VGS = 0V f = 1.0MHz Output Capacitance Coss — 652 — Reverse Transfer Capacitance Crss — 403 — Gate Resistance RG — 3.2 — Ω VDS = 0V, VGS = 0V, f = 1.0MHz Total Gate Charge (VGS = -4.5V) Qg — 39 — nC VDD = -10V, ID = -20A Total Gate Charge (VGS = -10V) Qg — 85 — Gate-Source Charge Qgs — 8.3 — Gate-Drain Charge Qgd — 9.6 — Turn-On Delay Time tD(ON) — 10.1 — ns VGS = -4.5V, VDD = -10V, RG = 1Ω, ID = -10A Turn-On Rise Time tR — 9.8 — Turn-Off Delay Time tD(OFF) — 61 — Turn-Off Fall Time tF — 51 — Reverse Recovery Time tRR — 20.1 — ns IF = -10A, di/dt = 100A/µs Reverse Recovery Charge Qrr — 10.1 — nC IF = -10A, di/dt = 100A/µs Notes: 5. RθJA is determined with the device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate. RθJC is guaranteed by design while RθJA is determined by the user’s board design. 6. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout. 7. Short duration pulse test used to minimize self-heating effect. 8. Guaranteed by design. Not subject to product testing. |
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