Product Specification

Revision: E

Date: November 11, 2015

© 2012 Samtec, Inc.

Page 7

7.4 Maximum Reflow Passes:

The parts can withstand 3 reflow passes at a maximum component temperature of

260°C.

7.5 Stencil Thickness:

The recommended stencil thickness is .006” (.15mm).

7.6 Placement:

Machine placement of the parts is recommended.

7.7 Reflow Environment:

Samtec recommends the use of a low level oxygen environment (typically achieved

through Nitrogen gas infusion) in the reflow process to improve solderability.

7.8 Rework Guidelines:

Samtec recommends following these rework guidelines as needed: QXX/BXX Connector

Rework Methods

7.9 Hardware: Board-to-board standoffs are recommended to provide a robust mechanical connection. Samtec offers

two different types:

7.9.1

Traditional Standoffs (SO)

– Rigid design to statically support board-to-board applications. See

options here:

SO - Board Stacking Standoff

7.9.2

Jack Screw Standoffs (JSO)

– Serve same function as traditional standoffs but unique, nested

construction facilitates the mating and unmating process. This is especially helpful for multiple

connector applications where the mating and unmating forces increase with the number of

connectors used. See options here:

JSO - Jack Screw Standoffs

7.10 Cleaning: Samtec, Inc. has verified that our connectors may be cleaned in accordance with the solvents and

conditions designated in the EIA-364-11A standard.

8.0 DIRECTION OF BOARD TRAVEL THROUGH REFLOW OVEN

8.1 To minimize the potential for connector warpage, Samtec recommends the layout configuration shown below

left. This allows the connectors to heat more evenly.