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LP2954IM Datasheet(PDF) 16 Page - Texas Instruments

Part # LP2954IM
Description  5-V and Adjustable Micropower LDOs
PDF  28 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

LP2954IM Datasheet(HTML) 16 Page - Texas Instruments

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LP2954, LP2954A
SNVS096E – JUNE 1999 – REVISED JULY 2016
www.ti.com
Product Folder Links: LP2954 LP2954A
Submit Documentation Feedback
Copyright © 1999–2016, Texas Instruments Incorporated
*See External Capacitors
PD = (((VIN – VOUT) × IOUT) + (VIN × IG))
Figure 20. Basic 5-V Regulator Circuit
The next parameter which must be calculated is the maximum allowable temperature rise, TR(MAX). This is
calculated by using the formula:
TR(MAX) = TJ(MAX) − TA(MAX)
where
•
TJ(MAX) is the maximum allowable junction temperature
•
TA(MAX) is the maximum ambient temperature
(8)
Using the calculated values for TR(MAX) and P(MAX), the required value for junction-to-ambient thermal resistance,
RθJA , can now be found:
RθJA = TR(MAX) / P(MAX)
(9)
If the calculated value is 60°C/W or higher , the regulator may be operated without an external heat sink. If the
calculated value is below 60°C/W, an external heatsink is required. The required thermal resistance for this heat
sink can be calculated using the formula:
RθHA = RθJA − RθJC(bot) − RθCH
where
•
RθJC(bot) is the junction-to-case thermal resistance, which is specified as 0.9°C/W maximum for the LP2954IT
•
RθCH is the case-to-heat-sink thermal resistance, which is dependent on the interfacing material (if used). For
details and typical values in Table 2 and Table 3.
•
Rθ(H-A) is the heatsink-to-ambient thermal resistance. It is this specification (listed on the heat-sink
manufacturers data sheet) which defines the effectiveness of the heat sink. The heat sink selected must have
a thermal resistance which is equal to or lower than the value of RθHA calculated from the above listed
formula.
(10)
Table 2. Typical Values of Case-To-Heatsink Thermal
Resistance (RθCH) (Data from Aavid Engineering)
UNIT
(C°/W)
Silicone grease
1
Dry interface
1.3
Mica with grease
1.4
Table 3. Typical Values Of Case-To-Heatsink Thermal
Resistance (RθCH) (Data from Thermalloy)
UNIT
(C°/W)
Thermasil III
1.3
Thermasil II
1.5
Thermalfilm (0.002) with grease
2.2



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