LP2987 datasheet(3/30 Pages) TI1

3 / 30 page

using:

The value of

θJ−A for the SOIC-8 (D) package is 160°C/W, and the VSSOP-8 (DGK) package is 200°C/W.

LP2987, LP2988

www.ti.com

SNVS004J – MARCH 1999 – REVISED APRIL 2013

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

ABSOLUTE MAXIMUM RATINGS

(1) (2)

Storage Temperature Range

−65°C to +150°C

Operating Junction

Temperature Range

−40°C to +125°C

Lead Temperature

(Soldering, 5 seconds)

260°C

ESD Rating (3)

2 kV

Power Dissipation (4)

Internally Limited

Input Supply Voltage

(Survival)

−0.3V to +16V

Input Supply Voltage

(Operating)

2.1V to +16V

Shutdown Pin

−0.3V to +16V

Sense Pin

−0.3V to +6V

Output Voltage

(Survival) (5)

−0.3V to +16V

IOUT (Survival)

Short Circuit Protected

Input-Output Voltage

(Survival) (6)

−0.3V to +16V

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Electrical specifications do not apply

when operating the device outside of its rated operating conditions.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and

specifications.

(3)

The ESD rating of the Bypass pin is 500V (LP2988 only). The ESD rating of the VIN pin is 1kV and the Delay pin is ESD rated at 1.5kV.

(4)

The maximum allowable power dissipation is a function of the maximum junction temperature, TJ(MAX), the junction-to-ambient thermal

resistance,

θJ−A, and the ambient temperature, TA. The maximum allowable power dissipation at any ambient temperature is calculated

The value

θJ−A for the WSON (NGN) package is specifically dependent on PCB trace area, trace material, and the number of layers and

thermal vias. For improved thermal resistance and power dissipation for the WSON package, refer to Application Note AN-1187

(literature number SNOA401). Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the

regulator will go into thermal shutdown.

(5)

If used in a dual-supply system where the regulator load is returned to a negative supply, the LM2987/8 output must be diode-clamped

to ground.

(6)

The output PNP structure contains a diode between the VIN and VOUT terminals that is normally reverse-biased. Forcing the output

above the input will turn on this diode and may induce a latch-up mode which can damage the part (see APPLICATION HINTS).

ELECTRICAL CHARACTERISTICS

Limits in standard typeface are for TJ = 25°C, and limits in boldface type apply over the full operating temperature range.

Unless otherwise specified: VIN = VO(NOM) + 1V, IL = 1 mA, COUT = 4.7 µF, CIN = 2.2 µF, VS/D = 2V.

LM2987/8AI-X.X (1)

LM2987/8I-X.X (1)

Symbol

Parameter

Conditions

Typical

Units

Min

Max

Min

Max

ΔVO

Output Voltage Tolerance

−0.5

0.5

−1.0

1.0

0.1 mA < IL < 200 mA

−0.8

0.8

−1.6

1.6

%VNOM

−1.8

1.8

−2.8

2.8

ΔVO/ΔVIN

Output Voltage Line

VO(NOM) + 1V ≤ VIN ≤ 16V

0.014

0.007

%/V

Regulation

0.032

(1)

Limits are 100% production tested at 25°C. Limits over the operating temperature range are specified through correlation using

Statistical Quality Control (SQC) methods. The limits are used to calculate TI's Average Outgoing Quality Level (AOQL).

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