LP3923

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SNVS567B – APRIL 2010 – REVISED MAY 2013

Absolute Maximum Ratings

(1) (2) (3)

−0.3V to +28V

−0.3V to +6.0V

All other inputs

150°C

Storage Temperature

−40°C to +150°C

Internally Limited

(5)

BATT, VIN1, VIN2, HF_PWR, CHG_IN, PWR_ON, VINB

8 kV HBM

(1)

All voltages are with respect to the potential at the GND pin.

(2)

Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which

operation of the device is ensured. Operating Ratings do not imply specified performance limits. For specified performance limits and

associated test conditions, see the Electrical Characteristics tables.

(3)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(4)

Care must be exercised where high power dissipation is likely. The maximum ambient temperature may have to be derated. Maximum

ambient temperature (TA-MAX) is dependant on the maximum operating junction temperature (TJ-MAX-OP), the maximum power

dissipation of the device in the application (PD-MAX), and the junction to ambient thermal resistance of the package in the application

(

θJA). This relationship is given by the following equation: TA-MAX = TJ-MAX-OP - (θJA x PD-MAX)

(5)

Internal Thermal Shutdown circuitry protects the device from permanent damage.

(6)

The human-body model is 100 pF discharged through 1.5 k

Ω. The machine model is a 200 pF capacitor discharged directly into each

pin, MIL-STD-883 3015.7.

Operating Ratings

(1) (2)

4.5 to 6.8V

3.0V to 5.5V

HF_PWR, PWR_ON

0V to 5.5V

ACOK_N, SDA, SCL, RX_EN, TX_EN, TCXO_EN, PS_HOLD, RESET_N

All other pins

−40°C to +125°C

(4)

−40°C to +85°C

(1)

Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which

operation of the device is ensured. Operating Ratings do not imply specified performance limits. For specified performance limits and

associated test conditions, see the Electrical Characteristics tables.

(2)

All voltages are with respect to the potential at the GND pin.

(3)

Full charging current is ensured for CHG_IN = 4.5 to 6.8V, but particularly at higher input voltages. Increased power dissipation may

cause the thermal regulation to limit the current to a safe level, resulting in longer charging time.

(4)

and cold limits are ensured by correlating the electrical characteristics to process and temperature variations and applying statistical

process control.

Thermal Properties

(5)

Junction-to-Ambient Thermal

Resistance (

(Jedec Standard Thermal PCB)

DSBGA 30

39°C/W

(5)

Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power

dissipation exists, special care must be paid to thermal dissipation issues in board design.

General Electrical Characteristics

(1)

(1)

and cold limits are ensured by correlating the electrical characteristics to process and temperature variations and applying statistical

process control.

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